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Cited 8 time in webofscience Cited 8 time in scopus
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Influence of high-pressure annealing on memory properties of Hf0.5Zr0.5O2 Based 1T-FeRAM

Authors
Yoon, J.S.[Yoon, J.S.]Tewari, A.[Tewari, A.]Shin, C.[Shin, C.]Jeon, S.[Jeon, S.]
Issue Date
Jul-2019
Publisher
Institute of Electrical and Electronics Engineers Inc.
Keywords
Ferroelectric films; hafnium zirconium oxide; high-pressure annealing; metal-ferroelectric-metal; nonvolatile memory
Citation
IEEE Electron Device Letters, v.40, no.7, pp.1076 - 1079
Indexed
SCIE
SCOPUS
Journal Title
IEEE Electron Device Letters
Volume
40
Number
7
Start Page
1076
End Page
1079
URI
https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/15021
DOI
10.1109/LED.2019.2918797
ISSN
0741-3106
Abstract
We investigated the impact of high-pressure annealing (HPA) on the memory properties of one-transistor dynamic random-access memory (1TDRAM) using a coupled geometry of a metal-ferroelectric (Hf0.5Zr0.5O2)-metal (MFM) capacitor connected in series with a gate insulator (SiO2) of a metal-oxide semiconductor field-effect transistor. The MFM capacitors were fabricated under different HPA conditions followed by the measurement of ferroelectric characteristics. The obtained results (polarization-electric field curves) were used for extracting the Landau-Khalatnikov coefficients, and these were used with the help of using Sentaurus TCAD tool, to theoretically study various characteristics of the coupled system (1TDRAM), such as sub-threshold swing (SS), memory window (MW), and ON/OFF current ratio (ION/IOFF). The output reflected that the MFM associated with 550°C HPA provides a wide MW (1.8-2.4 V based on area ratio), and the lowest SS (33mV/decade). Thus, the optimized HPA condition is promising in providing better results for various memory-based applications. © 1980-2012 IEEE.
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