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Continuously thermal conductive pathway of bidisperse boron nitride fillers in epoxy composite for highly efficient heat dissipation
- Authors
- Kim, J.M.[Kim, J.M.]; Jung, D.-W.[Jung, D.-W.]; Kim, L.S.[Kim, L.S.]; Kim, M.[Kim, M.]; Jeong, S.[Jeong, S.]; Lee, S.[Lee, S.]; Chang, S.-J.[Chang, S.-J.]; Cho, J.Y.[Cho, J.Y.]; Kim, S.H.[Kim, S.H.]; Park, J.Y.[Park, J.Y.]; Choi, K.[Choi, K.]; Yi, G.-R.[Yi, G.-R.]; Nam, K.M.[Nam, K.M.]; Lee, G.[Lee, G.]
- Issue Date
- Jun-2021
- Publisher
- Elsevier Ltd
- Keywords
- Composite material; Surface; Heat conduction
- Citation
- MATERIALS TODAY COMMUNICATIONS, v.27
- Indexed
- SCIE
SCOPUS
- Journal Title
- MATERIALS TODAY COMMUNICATIONS
- Volume
- 27
- ISSN
- 2352-4928
- Abstract
- This study presents a combined strategy of bidisperse boron nitride (BN) and surface modification to improve the thermal conductivity (κ) of the BN-epoxy composite. Surface modification of hexagonal BN was carried out with benzoic acid (BA). The optimal weight ratio of large and small BN (BNl and BNs) was 8:2 for their connectivity in the epoxy matrix. For 50 wt% filler content, the BNl8s2-BA composite has a much higher κ of 2.71 W/m K (out-plane direction), which is 12.3, 1.32, and 1.50 times higher than that of the pure epoxy, and its composite with BNl10s0-BA and BNl8s2, respectively. The chemical-sensitive analyses indicate that carboxyl-carboxylate interaction occurred in partially deprotonated benzoic acid on BN during the epoxy curing process, resulting in in-situ formation of a continuously thermal conductive pathway, which is responsible for the improved κ. © 2021 The Author(s)
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