Huynh H.A.[Huynh H.A.]; Han Y.[Han Y.]; Hwang J.[Hwang J.]; Song E.[Song E.]; Kim S.[Kim S.]
ArticleIssue Date2018Citation2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018, pp.345 - 349PublisherInstitute of Electrical and Electronics Engineers Inc.