Beyene, W.T.[Beyene, W.T.]; Madden, C.[ Madden, C.]; Chun, J.-H.[Chun, J.-H.]; Lee, H.[ Lee, H.]; Frans, Y.[ Frans, Y.]; Leibowitz, B.[ Leibowitz, B.]; Chang, K.[ Chang, K.]; Kim, N.[ Kim, N.]; Wu, T.[ Wu, T.]; Yip, G.[ Yip, G.], et al.
ArticleIssue Date2009CitationIEEE Transactions on Advanced Packaging, v.32, no.2, pp.306 - 327