Huynh, HA[Huynh, Hai Au]; Han, Y[Han, Youngbong]; Park, S[Park, Sanghyeok]; Hwang, J[Hwang, Jisoo]; Song, E[Song, Eunseok]; Kim, S[Kim, SoYoung]
ArticleIssue Date2018CitationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.4, pp.546 - 553PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC