Kim, K.[Kim, K.]; Kim, D.[Kim, D.]; Han, J.[Han, J.]; Lee, J.[Lee, J.]; Nah, W.[Nah, W.]
ArticleIssue Date2019CitationEMC Europe 2019 - 2019 International Symposium on Electromagnetic Compatibility, pp.492 - 497PublisherInstitute of Electrical and Electronics Engineers Inc.