Khan, D.[Khan, D.]; Oh, S.J.[Oh, S.J.]; Shehzad, K.[Shehzad, K.]; Verma, D.[Verma, D.]; Khan, Z.H.N.[Khan, Z.H.N.]; Pu, Y.G.[Pu, Y.G.]; Lee, M.[Lee, M.]; Hwang, K.C.[Hwang, K.C.]; Yang, Y.[Yang, Y.]; Lee, K.-Y.[Lee, K.-Y.]
ArticleIssue Date2019CitationIEEE Microwave and Wireless Components Letters, v.29, no.6, pp.415 - 417PublisherInstitute of Electrical and Electronics Engineers Inc.