파워디바이스 패키징의 열제어 기술과 연구 동향

Abstract

Technology for high power devices has made impressive progress in increasing the current density of powersemiconductor, system module, and design optimization, which realize high power systems with heterogeneous functionalintegration. Depending on the performance development of high power semiconductor, packaging technology of highpower device is urgently required for efficiency improvement of the device. Power device packaging must provide superiorthermal management due to high operating temperature of power modules. Here we, therefore, review critical challengesof typical power electronics packaging today including core assembly processes, component materials, and reliabilityevaluation regulations.