High-Speed Multilevel NAND Flash Memory With Tight V-th Distribution Using an Engineered Potential Well and Forward-Bias Adjusted Programming
- Authors
- Zhang, G[Zhang, Gang]; Wu, Z[Wu, Zhe]; Yoo, WJ[Yoo, Won Jong]
- Issue Date
- Oct-2011
- Keywords
- Engineered potential well (EW); forward-bias adjusted programming (FBAP); multilevel cell (MLC); nand Flash memory
- Citation
- IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.10, pp.3321 - 3328
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE TRANSACTIONS ON ELECTRON DEVICES
- Volume
- 58
- Number
- 10
- Start Page
- 3321
- End Page
- 3328
- URI
- https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/68813
- DOI
- 10.1109/TED.2011.2162731
- ISSN
- 0018-9383
- Abstract
- This paper reports a high-speed multilevel-cell NAND Flash memory device using a Si-SiO2-TiN-TiO2-SiO2-TaN (SOTTOT) engineered potential well (EW). The SOTTOT EW Flash memory device has very fast cell programming speed and good data retention. A 16-kbit NAND memory block using SOTTOT cells was programmed using a forward-bias-adjusted programming scheme, which enables bit adjustability during page programming to suppress the development of fast bits. The SOTTOT memory block shows fast programming speed (similar to 40 mu s/page), tight threshold voltage (V-th) distribution (similar to 0.22 V/level), and clear V-th-level margins (similar to 0.9 V) for the eight-level programming. The SOTTOT memory block also shows good resistance against pass/read disturbances as well as good ten-year data retention at an ambient temperature of 75 degrees C throughout 10(5) programming/erasing cycling.
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Collections - SKKU Advanced Institute of Nano Technology > ETC > 1. Journal Articles
- Graduate School > SKKU Advanced Institute of Nano Technology > 1. Journal Articles
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