Roles of F and O radicals and positive ions in a SF 6/0 2 plasma in forming deep via structures
- Authors
- Lim, Y.-D.[Lim, Y.-D.]; Lee, S.-H.[Lee, S.-H.]; Yoo, W.J.[Yoo, W.J.]; Jung, O.-J.[ Jung, O.-J.]; Kim, S.-C.[ Kim, S.-C.]; Lee, H.-C.[ Lee, H.-C.]
- Issue Date
- 2009
- Keywords
- Optical emission spectroscopy; Plasma; SF 6/O 2; Silicon; Via; XPS
- Citation
- Journal of the Korean Physical Society, v.54, no.5 PART 1, pp.1774 - 1778
- Indexed
- SCOPUS
KCI
- Journal Title
- Journal of the Korean Physical Society
- Volume
- 54
- Number
- 5 PART 1
- Start Page
- 1774
- End Page
- 1778
- URI
- https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/79279
- ISSN
- 0374-4884
- Abstract
- The roles of F and O radicals and of various positive ions in forming very high-aspect-ratio anisotropic via structures from Si have been investigated in SF 6/O 2 plasma with the help of analytical techniques using optical emission spectroscopy and X-ray photoelectron spectroscopy. The formation of the sidewall passivation layer was found to be greatly affected by both the horizontal and the vertical etching properties as a limited amount of F radicals was available inside deep via structures. Furthermore, an excessive amount of O radicals in the SF 6/O 2 plasma enhanced the formation of unwanted passivation layers on the bottoms of the vias. We also found that positive ions in the SF 6/O 2 plasma, e.g., SF x +, F + and 0 +, were likely to be responsible for horizontal etching.
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- Appears in
Collections - Graduate School > SKKU Advanced Institute of Nano Technology > 1. Journal Articles
- SKKU Advanced Institute of Nano Technology > ETC > 1. Journal Articles
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