Detailed Information
Cited 3 time in 
Cited 3 time in 
Cited 3 time in
Metadata Downloads
Electrical resistivities and TCR behavior of co-sputtered TaN-(Ag, Cu) nanocomposites
- Authors
- Park, I.-S.[Park, I.-S.]; Na, S.-H.[Na, S.-H.]; Kim, J.-S.[Kim, J.-S.]; Lim, S.-K.[Lim, S.-K.]; Kim, T.-S.[Kim, T.-S.]; Suh, S.-J.[Suh, S.-J.]; Lee, J.-W.[ Lee, J.-W.]; Yul-Kyo, C.[ Yul-Kyo, C.]; Oh, Y.-S.[ Oh, Y.-S.]
- Issue Date
- Jun-2009
- Publisher
- KOREAN PHYSICAL SOC
- Keywords
- Embedded resistor; Nanocomposites; TaN
- Citation
- Journal of the Korean Physical Society, v.54, no.6, pp.2323 - 2326
- Indexed
- SCIE
SCOPUS
KCI
- Journal Title
- Journal of the Korean Physical Society
- Volume
- 54
- Number
- 6
- Start Page
- 2323
- End Page
- 2326
- ISSN
- 0374-4884
- Abstract
- The motivation for this study arose from the potential to control electrical properties, such as the resistivity and the TCR, by fabricating TaN-metal nanocomposite films with electron scattering by nanoparticles in the tantalum-nitride matrix. The present work investigated the correlation between the electrical properties and the microstructures of the nanocomposite films. Co-deposited TaN-Ag and TaN-Cu nanocomposite thin films under a 55 % N 2partial pressure at a Ta power density of 8.78 W/cm 2 and at various Ag and Cu power densities were generated.
- Files in This Item
- There are no files associated with this item.
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.