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Study of a thin Al2O3/TaN absorber stack on Ru-capped multilayers

Authors
Kim, TG[Kim, Tae Geun]Kim, LH[Kim, Byung Hun]Kang, IY[Kang, In-Yong]Chung, YC[Chung, Yong-Chae]Ahn, J[Ahn, Jinho]Lee, SY[Lee, Seung Yoon]Park, IS[Park, In-Sung]Kim, CY[Kim, Chung Yong]Lee, NE[Lee, Nae-Eung]
Issue Date
Dec-2006
Publisher
KOREAN PHYSICAL SOC
Citation
JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.49, pp.S721 - S725
Indexed
SCIE
SCOPUS
KCI
Journal Title
JOURNAL OF THE KOREAN PHYSICAL SOCIETY
Volume
49
Start Page
S721
End Page
S725
URI
https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/86422
ISSN
0374-4884
Abstract
The glancing incident angle of an extreme ultraviolet lithography (EUVL) system requires minimal thickness of absorber patterns to suppress the shadow effect. High etch selectivity and low EUV reflectance can be obtained by a TaN absorber with a Ru buffer layer, but this structure does not offer enough DUV contrast (absorber/reflector) for inspection. A 20-nm-thick Al2O3 anti-reflection coating on top of 27-nm-TaN/2-nm-Ru is proposed as one of the optimum absorber stacks, which can give high EUV and DUV contrast with the thinnest structure ever reported.
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