TEM observation of interfacial reaction layers formed between Pb(Lead)-free Sn-3.5Ag solder and ENIG plated Cu substrate

Yoon, J.-W.[Yoon, J.-W.]; Jung, S.-B.[Jung, S.-B.]

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TEM observation of interfacial reaction layers formed between Pb(Lead)-free Sn-3.5Ag solder and ENIG plated Cu substrate

Authors: Yoon, J.-W.[Yoon, J.-W.]; Jung, S.-B.[Jung, S.-B.]

Issue Date: 2006

Citation: Materials Science Forum, v.510-511, pp.554 - 557

Journal Title: Materials Science Forum

Volume: 510-511

Start Page: 554

End Page: 557

URI: https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/88091

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Appears in Collections: Engineering > School of Advanced Materials Science and Engineering > 1. Journal Articles

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