Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Effects of H2 addition in magnetized inductively coupled C2F6 plasma etching of silica aerogel film
- Authors
- Wang S.-J.[Wang S.-J.]; Park H.-H.[Park H.-H.]; Hyun S.-H.[Hyun S.-H.]; Yeom G.-Y.[Yeom G.-Y.]
- Issue Date
- 2000
- Citation
- Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000, pp.206 - 207
- Journal Title
- Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000
- Start Page
- 206
- End Page
- 207
- Abstract
- Low k dielectrics not only lower line-to-line capacitance, but also reduce cross-talk noise in the interconnect and alleviate power dissipation issues. Silica aerogel film is a promising candidate for low-k innerlevel dielectrics by its ca. 70% porosity.1) As one of manufacture processes, etching behavior was considered with the increasing of H2 gas addition to C2F6 gas.
- Files in This Item
- There are no files associated with this item.
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.