Thermal performance evaluation of Bio-based shape stabilized PCM with boron nitride for energy saving
- Authors
- Jeong, Su-Gwang; Lee, Jeong-Hun; Seo, Jungki; Kim, Sumin
- Issue Date
- Apr-2014
- Publisher
- PERGAMON-ELSEVIER SCIENCE LTD
- Keywords
- Bio-based PCM; Boron nitride; Thermal properties; Impregnation
- Citation
- INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.71, pp.245 - 250
- Journal Title
- INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- Volume
- 71
- Start Page
- 245
- End Page
- 250
- URI
- http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/10079
- DOI
- 10.1016/j.ijheatmasstransfer.2013.12.017
- ISSN
- 0017-9310
- Abstract
- Among the PCMs, Bio-based PCMs are considered one of the most promising candidates, due to their large latent heat, low vapor pressure in the melt, good chemical stability, self-nucleating behavior, safety, and commercial availability at low cost. However, the leakage problem and low thermal conductivity of Bio-based PCM limit its application, to some extent. Therefore, porous materials with a high thermal conductivity, such as boron nitride, are promising candidates for simultaneously solving these two problems. In this study, we prepared Bio-based PCM with boron nitride, by using the vacuum impregnation process. We analyzed the microstructure, chemical bonding, heat capacity, thermal resistance and Thermal conductivity of Bio-based PCM with boron nitride, by SEM, FTIR, DSC, TGA and TCi analyses. From the analyses, we expect Bio-based PCM with boron nitride to be useful in applications in various fields, due to its high thermal properties. (C) 2014 Published by Elsevier Ltd.
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Collections - College of Engineering > School of Architecture > 1. Journal Articles
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