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반도체 패키지의 층간박리 파괴역학인자 해석 및 균열진전경로 예측
- Issue Date
- 2009
- Publisher
- 한국생산제조학회
- Keywords
- Large Scale Integration(LSI); Thermal Stress(열응력); Delamination(층간박리); Crack Propagation Angle(균열진전각); Bonded Interface Edge(접합계면단); Stress Intensity Factor(응력세기계수); Boundary Element Method(경계요소법)
- Citation
- 한국생산제조학회지, v.18, no.4, pp.401 - 409
- Journal Title
- 한국생산제조학회지
- Volume
- 18
- Number
- 4
- Start Page
- 401
- End Page
- 409
- ISSN
- 2508-5093
- Abstract
- This paper presents a method of calculating the stress intensity factor and crack propagation direction (θ0) at the crack-tip that is associated with delamination in the large scale integration(LSI) package. To establish a reasonable strength evaluation method and life prediction , it is necessary to assess fracture parameters under various fracture conditions. Therefore, we conducted quantitative stress singularity analysis considering thermal stress simulating the changes of crack length (a), (h) and (v) in delamination using the 2-dimensional elastic boundary element method (BEM), and from these results predicted crack propagation direction and path.
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Collections - College of Engineering > Department of Mechanical Engineering > 1. Journal Articles
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