Detection of interfacial crack length by using ultrasonic attenuation coefficients on adhesively bonded joints
DC Field | Value | Language |
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dc.contributor.author | Chung, NY | - |
dc.contributor.author | Park, SI | - |
dc.date.available | 2018-05-10T18:02:36Z | - |
dc.date.created | 2018-04-17 | - |
dc.date.issued | 2004-12 | - |
dc.identifier.issn | 1229-9138 | - |
dc.identifier.uri | http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/19944 | - |
dc.description.abstract | In this paper, an interfacial crack length has been detected by using the ultrasonic attenuation coefficient on the adhesively bonded double-cantilever beam (DCB) joints. The correlations between energy release rates which were investigated by experimental measurement, the boundary element method (BEM) and Ripling's equation are compared with each other. The experimental results show that the interfacial crack length for the ultrasonic attenuation coefficient and energy release rate increases proportionally. From the experimental results, we propose a method to detect the interfacial crack length by using the ultrasonic attenuation coefficient and discuss it. | - |
dc.publisher | KOREAN SOC AUTOMOTIVE ENGINEERS-KSAE | - |
dc.relation.isPartOf | INTERNATIONAL JOURNAL OF AUTOMOTIVE TECHNOLOGY | - |
dc.subject | WAVES | - |
dc.subject | TRANSDUCERS | - |
dc.subject | DISPERSION | - |
dc.title | Detection of interfacial crack length by using ultrasonic attenuation coefficients on adhesively bonded joints | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | INTERNATIONAL JOURNAL OF AUTOMOTIVE TECHNOLOGY, v.5, no.4, pp.303 - 309 | - |
dc.identifier.kciid | ART001169262 | - |
dc.description.journalClass | 1 | - |
dc.identifier.wosid | 000225582300009 | - |
dc.identifier.scopusid | 2-s2.0-33745603676 | - |
dc.citation.endPage | 309 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 303 | - |
dc.citation.title | INTERNATIONAL JOURNAL OF AUTOMOTIVE TECHNOLOGY | - |
dc.citation.volume | 5 | - |
dc.contributor.affiliatedAuthor | Chung, NY | - |
dc.type.docType | Article | - |
dc.subject.keywordAuthor | acoustic impedance | - |
dc.subject.keywordAuthor | adhesively bonded joint | - |
dc.subject.keywordAuthor | attenuation coefficient | - |
dc.subject.keywordAuthor | boundary element method | - |
dc.subject.keywordAuthor | compliance | - |
dc.subject.keywordAuthor | double-cantilever beam | - |
dc.subject.keywordAuthor | energy release rate | - |
dc.subject.keywordAuthor | interface crack | - |
dc.subject.keywordAuthor | transmission coefficient | - |
dc.subject.keywordAuthor | ultrasonic test | - |
dc.subject.keywordPlus | WAVES | - |
dc.subject.keywordPlus | TRANSDUCERS | - |
dc.subject.keywordPlus | DISPERSION | - |
dc.description.journalRegisteredClass | scopus | - |
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