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펄스-에코법을 이용한 접착접합 시험편의 정량적비파괴평가Quantitative Nondestructive Evaluation of Bonded Joints utilizing Pulse-Echo Ultrasonic Test
- Other Titles
- Quantitative Nondestructive Evaluation of Bonded Joints utilizing Pulse-Echo Ultrasonic Test
- Issue Date
- Mar-2003
- Publisher
- 한국정밀공학회
- Citation
- 한국정밀공학회지, v.20, no.3, pp.176
- Journal Title
- 한국정밀공학회지
- Volume
- 20
- Number
- 3
- Start Page
- 176
- ISSN
- 1225-9071
- Files in This Item
- Go to Link
- Appears in
Collections - College of Engineering > ETC > 1. Journal Articles
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