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자기결합을 이용한 3D-IC 무선 데이터 전송 송수신 단 설계
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박창근 | - |
| dc.date.available | 2018-06-12T07:12:28Z | - |
| dc.date.created | 2018-06-11 | - |
| dc.date.issued | 2017-02 | - |
| dc.identifier.uri | http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/23402 | - |
| dc.publisher | 대한전자공학회 | - |
| dc.relation.isPartOf | 한국반도체학술대회 Chip Design Contest (CDC) 2017 | - |
| dc.title | 자기결합을 이용한 3D-IC 무선 데이터 전송 송수신 단 설계 | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.identifier.bibliographicCitation | 한국반도체학술대회 Chip Design Contest (CDC) 2017 | - |
| dc.description.journalClass | 2 | - |
| dc.citation.conferenceDate | 2017-02 | - |
| dc.citation.conferencePlace | KO | - |
| dc.citation.conferencePlace | 대명비발디, 강원도 홍천 | - |
| dc.citation.title | 한국반도체학술대회 Chip Design Contest (CDC) 2017 | - |
| dc.contributor.affiliatedAuthor | 박창근 | - |
| dc.type.docType | Article; Proceedings Paper | - |
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Related Researcher
- Park, Chang kun
- College of Information Technology (Major in Electronic Engineering)