IMPROVING THERMAL CONDUCTIVITY OF PLYWOOD ON FLOORING FOR RADIANT FLOOR HEATING SYSTEM TO SAVE HEATING ENERGY

김수민

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IMPROVING THERMAL CONDUCTIVITY OF PLYWOOD ON FLOORING FOR RADIANT FLOOR HEATING SYSTEM TO SAVE HEATING ENERGY

Authors: 김수민

Issue Date: Oct-2013

Publisher: Forest Products Society

Citation: International Conference on Wood Adhesives

URI: http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/25470

Conference Name: International Conference on Wood Adhesives

Place: US
Toronto, Canada

Conference Date: 2013-10

Files in This Item: There are no files associated with this item.

Appears in Collections: College of Engineering > School of Architecture > 2. Conference Papers

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