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Electrical Characterization of the Through Via in Package-on Package with Interposer using Parameter Extraction Method
- Authors
- 김부균
- Issue Date
- Jan-2011
- Publisher
- Shandong University and Soongsil University
- Citation
- The Second International Conference on Smart IT Applications
- Conference Name
- The Second International Conference on Smart IT Applications
- Place
- CN
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Collections - College of Information Technology > ETC > 2. Conference Papers
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Related Researcher
- Kim, Boo Gyoun
- Department of Electronic Engineering