Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter Extraction Method

위재경

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Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter Extraction Method

Authors: 위재경

Issue Date: May-2010

Publisher: Journal of Measurement Science and Instrumentation

Citation: Journal of Measurement Science and Instrumentation

URI: http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/27616

Conference Name: Journal of Measurement Science and Instrumentation

Place: CN

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Appears in Collections: College of Information Technology > ETC > 2. Conference Papers

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