Copper electrodeposition on polyimide substrate using polyaniline film as a seed layer for metallization of flexible devices
- Authors
- Lee, D.; Lim, T.; Lim, H.; Kim, H.-J.; Kwon, O.J.
- Issue Date
- Nov-2018
- Publisher
- Electrochemical Science Group
- Keywords
- Copper; Electrodeposition; Flexible printed circuit board; Palladium; Polyaniline; Seed layer
- Citation
- International Journal of Electrochemical Science, v.13, no.12, pp.11829 - 11838
- Journal Title
- International Journal of Electrochemical Science
- Volume
- 13
- Number
- 12
- Start Page
- 11829
- End Page
- 11838
- URI
- http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/31013
- DOI
- 10.20964/2018.12.56
- ISSN
- 1452-3981
- Abstract
- The Metallization of flexible printed circuit boards is a key issue for the fabrication of flexible devices. In this study, Cu electrodeposition was performed on a flexible polyimide substrate using polyaniline film as a seed layer for the first time. A conductive polyaniline film was formed on the surface of the polyimide substrate by dip and spin coating methods. It was revealed that the spin coating method was advantageous in forming a uniform and continuous polyaniline film because it reduces the secondary nucleation of polyaniline by removing excess reactants from the polyimide substrate. Pd nanoparticles were also introduced onto the polyaniline-deposited substrate to promote Cu nucleation during the Cu electrodeposition process. With the aid of polyaniline film and Pd nanoparticles, a continuous and uniform Cu film was successfully deposited on a polyimide substrate. © 2018 The Authors.
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