폴리실록산과 폴리실라잔 기반 유기실리콘 LED 봉지재의 제조Organosilicon LED Encapsulants Based on Polysiloxane and Polysilazane
- Other Titles
- Organosilicon LED Encapsulants Based on Polysiloxane and Polysilazane
- Authors
- 은희천; 허태환; 곽영제
- Issue Date
- Jun-2018
- Publisher
- 한국섬유공학회
- Keywords
- LED encapsulant; organosilicon; polysilazane; transparency; hardness
- Citation
- 한국섬유공학회지, v.55, no.3, pp.211 - 214
- Journal Title
- 한국섬유공학회지
- Volume
- 55
- Number
- 3
- Start Page
- 211
- End Page
- 214
- URI
- http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/31551
- DOI
- 10.12772/TSE.2018.55.211
- ISSN
- 1225-1089
- Abstract
- A mixture of polysiloxane (PSO) and polysilazane (PSZ) was used to prepare a crosslinked organosilicon material for use as an LED encapsulant. The crosslinking was conducted by using two different chemistries: platinum-catalyzed hydrosilylation and peroxide- initiated radical reaction. Successful crosslinking was confirmed by FT-IR spectroscopy, which showed decreased intensities of vinyl (3,100 cm-1) and hydrosilane (2,140 cm-1) peaks. The prepared films showed high transparency (>90% at 400 nm) because of the high compatibility between PSO and PSZ. The crosslinked organosilicon films showed higher hardness values when both PSO and PSZ were used at the same time, indicating higher crosslinking density.
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