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폴리실록산과 폴리실라잔 기반 유기실리콘 LED 봉지재의 제조Organosilicon LED Encapsulants Based on Polysiloxane and Polysilazane

Other Titles
Organosilicon LED Encapsulants Based on Polysiloxane and Polysilazane
Authors
은희천허태환곽영제
Issue Date
Jun-2018
Publisher
한국섬유공학회
Keywords
LED encapsulant; organosilicon; polysilazane; transparency; hardness
Citation
한국섬유공학회지, v.55, no.3, pp.211 - 214
Journal Title
한국섬유공학회지
Volume
55
Number
3
Start Page
211
End Page
214
URI
http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/31551
DOI
10.12772/TSE.2018.55.211
ISSN
1225-1089
Abstract
A mixture of polysiloxane (PSO) and polysilazane (PSZ) was used to prepare a crosslinked organosilicon material for use as an LED encapsulant. The crosslinking was conducted by using two different chemistries: platinum-catalyzed hydrosilylation and peroxide- initiated radical reaction. Successful crosslinking was confirmed by FT-IR spectroscopy, which showed decreased intensities of vinyl (3,100 cm-1) and hydrosilane (2,140 cm-1) peaks. The prepared films showed high transparency (>90% at 400 nm) because of the high compatibility between PSO and PSZ. The crosslinked organosilicon films showed higher hardness values when both PSO and PSZ were used at the same time, indicating higher crosslinking density.
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