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Tunable Charge Injection via Solution-Processed Reduced Graphene Oxide Electrode for Vertical Schottky Barrier Transistors

Authors
Choi, Young JinKim, Jong SuCho, Joon YoungWoo, Hwi JeYang, JeehyeSong, Young JaeKang, Moon SungHan, Joong TarkCho, Jeong Ho
Issue Date
Feb-2018
Publisher
AMER CHEMICAL SOC
Citation
CHEMISTRY OF MATERIALS, v.30, no.3, pp.636 - 643
Journal Title
CHEMISTRY OF MATERIALS
Volume
30
Number
3
Start Page
636
End Page
643
URI
http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/32025
DOI
10.1021/acs.chemmater.7b03460
ISSN
0897-4756
Abstract
We demonstrate, for the first time, the use of a solution-processed reduced graphene oxide (rGO) layer as a work function tunable electrode in vertical Schottky barrier (SB) transistors. The rGO electrodes were deposited by simple spray-coating onto the substrate. The vertical device structure was formed by sandwiching a N,N'-dioctyl-3,4,9,10-perylenedicarboximide (PTCDI-C-8) organic semiconductor between rGO and Al electrodes. By varying the voltage applied to the gate electrode, the work function of rGO and thus the SB formed at the rGO-PTCDI-C-8 interface could be effectively modulated. The resulting vertical SB transistors based on rGO-PTCDI-C-8 heterostructures exhibited excellent electrical properties, including a maximum current density of 17.9 mA/cm(2) and an on-off current ratio >10(3), which were comparable with the values obtained for the devices based on a CVD-grown graphene electrode. The charge injection properties of the vertical devices were systematically investigated through temperature-dependent transport measurements. Charge injection was dominated by thermionic emission at high temperature. As the temperature decreased, however, impurity state-assisted hopping occurred. At low temperature and negative gate voltage, the reduced width of barrier induced by a high drain voltage yielded Fowler-Nordheim tunneling at the interface. The use of scalable solution-processed rGO as a work function tunable electrode in vertical SB transistors opens up new opportunities for realizing future large-area flexible two-dimensional materials-based electronic devices.
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