Optimization of multichip bonding on a SiOB platform for bidirectional optical subassembly using design of experiment
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lim, J.W. | - |
dc.contributor.author | Hwang, S.H. | - |
dc.contributor.author | Lee, W.-J. | - |
dc.contributor.author | Kim, M.J. | - |
dc.contributor.author | Kim, S.H. | - |
dc.contributor.author | Hann, S. | - |
dc.contributor.author | Kim, J.-S. | - |
dc.contributor.author | Kim, B.-G. | - |
dc.contributor.author | Rho, B.S. | - |
dc.date.available | 2019-04-10T10:59:22Z | - |
dc.date.created | 2018-04-17 | - |
dc.date.issued | 2010 | - |
dc.identifier.isbn | 9784885522451 | - |
dc.identifier.uri | http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/33322 | - |
dc.description.abstract | We propose an assembly technique with optimum condition capable of performing high density multichip integration on a silicon optical bench platform using the design of experiment. We integrated the eight chips on a platform for 4 channels arrayed optical subassembly above 2.5Gb/s/ch. | - |
dc.relation.isPartOf | Technical Digest - 15th OptoElectronics and Communications Conference, OECC2010 | - |
dc.title | Optimization of multichip bonding on a SiOB platform for bidirectional optical subassembly using design of experiment | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.identifier.bibliographicCitation | 15th OptoElectronics and Communications Conference, OECC2010, pp.846 - 847 | - |
dc.description.journalClass | 2 | - |
dc.identifier.scopusid | 2-s2.0-78649285771 | - |
dc.citation.conferenceDate | 2010-07-05 | - |
dc.citation.conferencePlace | Sapporo | - |
dc.citation.endPage | 847 | - |
dc.citation.startPage | 846 | - |
dc.citation.title | 15th OptoElectronics and Communications Conference, OECC2010 | - |
dc.contributor.affiliatedAuthor | Kim, B.-G. | - |
dc.type.docType | Conference Paper | - |
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