Module design using 2-layers PCB for an automotive BLDC motor driver
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, C.-G. | - |
dc.contributor.author | Lee, T.-H. | - |
dc.contributor.author | Kim, S.-K. | - |
dc.contributor.author | Jeon, J.-Y. | - |
dc.contributor.author | Wee, J.-K. | - |
dc.date.available | 2019-04-10T11:17:46Z | - |
dc.date.created | 2018-04-17 | - |
dc.date.issued | 2008 | - |
dc.identifier.isbn | 9781424426331 | - |
dc.identifier.uri | http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/33587 | - |
dc.description.abstract | This paper reports the PCB design method of a 2- layers PCB stack-up instead of a 4-layers PCB stack-up for a BLDC motor driver. PCB design methodology is suggested to protect a system from performance decline in design of a 2-layers PCB system compared with a 4-layers system. For system specs, the maximum frequency of the BLDC motor drive module is 8MHz and the operating voltage and peak current are 12V and 10A. The environment temperature and tolerable maximum temperature are given at 120°C and 180°C. For keeping its performance, electrically qualifying design methods of signal integrity, power integrity and EMI problems are considered and are proven through their performances compared with 4-Layers PCB system. The simulated results of designed 2-layers module show the successful design of a 2-layers PCB BLDC motor drive without any module area penalty and performance degradation. © 2008 IEEE. | - |
dc.relation.isPartOf | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings | - |
dc.title | Module design using 2-layers PCB for an automotive BLDC motor driver | - |
dc.type | Conference | - |
dc.identifier.doi | 10.1109/EDAPS.2008.4736011 | - |
dc.type.rims | CONF | - |
dc.identifier.bibliographicCitation | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.109 - 112 | - |
dc.description.journalClass | 2 | - |
dc.identifier.scopusid | 2-s2.0-60649104230 | - |
dc.citation.conferenceDate | 2008-12-10 | - |
dc.citation.conferencePlace | Seoul | - |
dc.citation.endPage | 112 | - |
dc.citation.startPage | 109 | - |
dc.citation.title | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 | - |
dc.contributor.affiliatedAuthor | Wee, J.-K. | - |
dc.type.docType | Conference Paper | - |
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