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A delay estimation method using reduced model of RLC interconnects

Authors
Park, C.-W.Jeong, M.-S.Kim, K.-Y.Kim, S.-Y.
Issue Date
2008
Citation
2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.222 - 225
URI
http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/33631
DOI
10.1109/EDAPS.2008.4736040
Conference Name
2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Place
Seoul
Conference Date
2008-12-10
ISBN
9781424426331
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College of Information Technology > School of Computer Science and Engineering > 2. Conference Papers

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