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Nondestructive evaluation of adhesively bonded joints using ultrasonic technique

Authors
Yi, WJang, CSHan, JYKim, MG
Issue Date
2004
Publisher
TRANS TECH PUBLICATIONS LTD
Citation
Proceedings of the 11th Asian Pacific Conference on Nondestructive Testing, v.270-273, pp.1833 - 1838
URI
http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/34274
DOI
10.4028/www.scientific.net/KEM.270-273.1833
Conference Name
Proceedings of the 11th Asian Pacific Conference on Nondestructive Testing
Place
GE
Jeju Island
Conference Date
2003-11-03
ISSN
1013-9826
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