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Gain enhancement of microstrip patch antenna with via holes structure

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dc.contributor.authorNinh Dang-Duy-
dc.contributor.authorYoon, Nanae-
dc.contributor.authorSeo, Chulhun-
dc.date.available2019-05-20T03:40:02Z-
dc.date.created2019-05-20-
dc.date.issued2019-05-
dc.identifier.issn2187-0136-
dc.identifier.urihttp://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/34733-
dc.description.abstractMicrostrip patch antenna (MPA) with loading of shorting pins expressed as a high gain and planar structure. The inductive effect of shorting pin tunes up the resonant frequency leading to increase the electrical size of antenna and, in consequence, its radiation directivity is enhanced. This work proposes a new configuration of MPA with loading of via holes to achieve gain enhancement. The field distribution is analyzed to optimize position of via holes. A prototype of proposed MPA is fabricated and shows excellent realized gain of 11.3 dBi that enhance about by 1.3 dB in comparison to the previous work.-
dc.language영어-
dc.language.isoen-
dc.publisherIEICE-INST ELECTRONICS INFORMATION COMMUNICATIONS ENG-
dc.relation.isPartOfIEICE COMMUNICATIONS EXPRESS-
dc.titleGain enhancement of microstrip patch antenna with via holes structure-
dc.typeArticle-
dc.identifier.doi10.1587/comex.2018XBL0124-
dc.type.rimsART-
dc.identifier.bibliographicCitationIEICE COMMUNICATIONS EXPRESS, v.8, no.5, pp.190 - 195-
dc.description.journalClass1-
dc.identifier.wosid000466556100011-
dc.citation.endPage195-
dc.citation.number5-
dc.citation.startPage190-
dc.citation.titleIEICE COMMUNICATIONS EXPRESS-
dc.citation.volume8-
dc.contributor.affiliatedAuthorSeo, Chulhun-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.subject.keywordAuthormicrostrip patch antenna-
dc.subject.keywordAuthorgain enhancement-
dc.subject.keywordAuthorshorting via holes-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
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