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Ultralarge-area block copolymer lithography using self-assembly assisted photoresist pre-pattern

Authors
Jin, H.-M.Jeong, S.-J.Moon, H.-S.Kim, B.H.Kim, J.Y.Yu, J.Lee, S.Lee, M.G.Choi, H.Kim, S.O.
Issue Date
Oct-2011
Publisher
IEEE
Citation
2011 IEEE Nanotechnology Materials and Devices Conference, NMDC 2011, pp.527 - 533
Journal Title
2011 IEEE Nanotechnology Materials and Devices Conference, NMDC 2011
Start Page
527
End Page
533
URI
http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/39502
DOI
10.1109/NMDC.2011.6155284
ISSN
0000-0000
Abstract
These We accomplished truly scalable, low cost, arbitrarily large-area block copolymer lithography, synergistically integrating the two principles of graphoepitaxy and epitaxial self-assembly. Graphoepitaxy morphology composed of highly aligned lamellar block copolymer film that self-assembled within a disposable photoresist trench pattern was prepared by conventional I-line lithography and utilized as a chemical nanopatterning mask for the underlying substrate. After the block copolymer film and disposable photoresist layer were removed, the same lamellar block copolymer film was epitaxially assembled on the exposed chemically patterned substrate. Highly oriented lamellar morphology was attained without any trace of structure directing the photoresist pattern over an arbitrarily large area. © 2011 IEEE.
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