Heat-induced spontaneous and damage-free separation of transparent polymer thin films based on clickable decomposition of pyrolytic core-shell nanocapsules
- Authors
- An, Jongil; Kim, Soyern; Choi, Jin-Wook; Son, Seung-Rak; Park, Jisung; Park, Chan Beom; Lee, Jun Hyup
- Issue Date
- Mar-2022
- Publisher
- ELSEVIER
- Keywords
- Microbubbles; Polymer thin films; Pyrolytic nanocapsules; Spontaneous separation; Thermal decomposition
- Citation
- MATERIALS TODAY COMMUNICATIONS, v.30
- Journal Title
- MATERIALS TODAY COMMUNICATIONS
- Volume
- 30
- URI
- http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/42002
- DOI
- 10.1016/j.mtcomm.2021.103079
- ISSN
- 2352-4928
- Abstract
- The automatic and damage-free manipulation for efficient separation of polymer thin films from various substrates has received growing interests in a broad range of applications from electronic devices to optical films because it can realize the innovative recycling and on-demand spontaneous detachment of scarce and valuable materials. Herein, we demonstrate a spontaneous and damage-free separation methodology for transparent polymer thin films based on the heat-induced microbubble generation from pyrolytic core-shell nanocapsules at the interface between the substrate and the thin film. The pyrolytic polymer nanocapsules were fabricated by encapsulating a latent gas-forming agent of benzenesulfonyl hydrazine in the crosslinked copolymer nanoparticle comprising polyacrylonitrile and poly(methyl methacrylate). The heat-induced clickable decomposition of pyrolytic core-shell nanocapsules generated a significant number of microbubbles inside the thin film, thereby inducing instantaneous and effortless detachment of the transparent film from substrate. The fabricated polymer thin films embedded with a small number of pyrolytic polymer nanocapsules afforded an excellent debonding performance with a maximum efficiency of 93.4% after short thermal treatment compared to that of the pristine thin films, simultaneously maintaining a remarkable optical clarity of about 99% and a high initial adhesion strength with a maximum of approximately 22 kgf cm(-2).
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Collections - College of Engineering > Department of Chemical Engineering > 1. Journal Articles
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