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Transceiver for Wireless Power Transfer Using a Cross-Coupled Oscillator for a Wireless On-Wafer Test

Authors
Lee, MilimLee, ChanghyunPark, Changkun
Issue Date
Aug-2017
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Coil; receiver; 3-D integrated circuit (IC); transmitter; on-wafer test
Citation
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, v.66, no.8, pp.2097 - 2105
Journal Title
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT
Volume
66
Number
8
Start Page
2097
End Page
2105
URI
http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/6290
DOI
10.1109/TIM.2017.2677658
ISSN
0018-9456
Abstract
In this paper, we propose a transceiver architecture for wireless on-wafer test systems. To obtain a compact transceiver, the dc-ac converter, an essential component in typical wireless power transfer (WPT) systems, is removed. Instead of the converter, the output power of the oscillator is used as the transmitted power in the transmitter. To reduce the number of required inductors in the transceiver and, hence, the chip size, the inductor of the cross-coupled oscillator is used as the transmitter coil. Consequently, the proposed transceiver becomes sufficiently simple and compact to be applied to wireless on-wafer test systems. To verify the feasibility of the proposed topology, we designed the proposed transceiver using the 180-nm RFCMOS technology. From the measurement results of various designed transmitters and receivers, we obtain a maximum efficiency of 37% when the transmitter power is approximately 11.5 dBm. From the measured results, we successfully prove the feasibility of the proposed transceiver for wireless on-wafer test systems.
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