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Cited 13 time in webofscience Cited 13 time in scopus
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Solvent-Free Processable and Photo-Patternable Hybrid Gate Dielectric for Flexible Top-Gate Organic Field-Effect Transistors

Authors
Kwon, Jun SeonPark, Han WoolKim, Do HwanKwark, Young-Je
Issue Date
15-Feb-2017
Publisher
AMER CHEMICAL SOC
Keywords
solvent-free process; photopatternable; hybrid dielectrics; polysiloxane; flexible top-gate OFETs
Citation
ACS APPLIED MATERIALS & INTERFACES, v.9, no.6, pp.5366 - 5374
Journal Title
ACS APPLIED MATERIALS & INTERFACES
Volume
9
Number
6
Start Page
5366
End Page
5374
URI
http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/6455
DOI
10.1021/acsami.6b14500
ISSN
1944-8244
Abstract
We report a novel solvent-free and direct photopatternable poly[(mercaptopropyl)methyl-siloxane] (PMMS) hybrid dielectric for flexible top-gate organic field-effect transistors (OFETs) utilizing a photoactivated thiol-ene reaction under UV irradiation of 254 nm to induce cross-linking, even in air and at low temperatures. In particular, a solvent-free PMMS-f dielectric film, for which an optimal cross-linking density is shown by a well-organized molar ratio between thiol and vinyl in the thiol-ene reaction, exhibited a high dielectric constant (5.4 @ 100 Hz) and a low leakage current (<1 nA mm(-2) @ 2 MV cm(-1)). The excellent dielectric characteristics of the solvent-free PMMS-hybrid dielectrics, along with their other unique characteristics of a direct photopatternability for which UV-nanoimprint lithography is used and a high surface energy of 45.6 mJ m(-2), allowed the successful application of the dielectrics to flexible solvent-free top-gate OFETs with a high reliability against the radius of curvature (9.5, 7.0, and 5.5 mm) and repetitive bending cycles at the radius of curvature of 5.5 mm. This will eventually enable the proposed dielectric design to be used in a variety of applications such as flexible displays and soft organic sensors including chemical and tactile capability.
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College of Engineering (Department of Materials Science and Engineering)
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