반도체 구리 배선공정에서 표면 전처리가 이후 구리 전해/무전해 전착 박막에 미치는 영향Effect of Surface Pretreatment on Film Properties Deposited by Electro-/Electroless Deposition in Cu Interconnection
- Other Titles
- Effect of Surface Pretreatment on Film Properties Deposited by Electro-/Electroless Deposition in Cu Interconnection
- Authors
- Lim, Taeho; Kim, Jae Jeong
- Issue Date
- Feb-2017
- Publisher
- KOREAN ELECTROCHEMICAL SOC
- Keywords
- Cu; Electrodeposition; Electroless; Oxide; Pretreatment
- Citation
- JOURNAL OF THE KOREAN ELECTROCHEMICAL SOCIETY, v.20, no.1, pp.1 - 6
- Journal Title
- JOURNAL OF THE KOREAN ELECTROCHEMICAL SOCIETY
- Volume
- 20
- Number
- 1
- Start Page
- 1
- End Page
- 6
- URI
- http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/6471
- DOI
- 10.5229/JKES.2017.20.1.1
- ISSN
- 1229-1935
- Abstract
- This study investigated the effect of surface pretreatment, which removes native Cu oxides on Cu seed layer, on subsequent Cu electro-/electroless deposition in Cu interconnection. The native Cu oxides were removed by using citric acid-based solution frequently used in Cu chemical mechanical polishing process and the selective Cu oxide removal was successfully achieved by controlling the solution composition. The characterization of electro-/electrolessly deposited Cu films after the oxide removal was then performed in terms of film resistivity, surface roughness, etc. It was observed that the lowest film resistivity and surface roughness were obtained from the substrate whose native Cu oxides were selectively removed.
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