ScholarWorks@Soongsil University: Kim, Bo Hyun

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Kim, Bo Hyun (김보현)

College of Engineering (School of Mechanical Engineering)

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Micro EDM:3||Micro tool:3||Micro ECM:3||Wire electrodischarge grinding:2||Hard turning:2||Micro Machining (미세 가공):2||Sapphire:2||Molecular dynamics:2||다결정 다이아몬드:2||fused silica:2||미세 공구:2||PCD:2||Electrochemical etching:2||와이어 방전 연삭:2||초경합금:2||Polycrystalline Diamond (다결정 다이아몬드):2||Micromachining:2||Polycrystalline diamond:2||Electrical discharge machining:2||Fabrication:1||Focused ion beam:1||Friction:1||Friction reduction:1||Glass:1||Glass (유리):1||Grinding (연삭):1||Hard cutting:1||Hardened steel:1||Hierarchical patterns:1||High frequency AC power source:1||Hot imprinting:1||Hotembossing (핫엠보싱 공정):1||Hotembossing (핫엠보싱 공정):1||Hybrid Machining (복합 가공):1||Hybrid machining:1||Hybrid method:1||Indentation:1||Labonachip:1||Large diameter:1||Laser:1||Light concentrating ratio (집광도):1||Low frequency:1||Machining:1||Mechanical machining:1||Micro ECDM:1||Micro Electrochemical Machining (미세 전해 가공):1||Micro Grinding:1||Micro Hole (미세 구멍):1||Micro Molding Method:1||Micro channel:1||Micro column:1||Micro dimple:1||Micro drilling:1||Micro electrical machining:1||Micro fibrils:1||Micro hole:1||Micro machining:1||Micro pin:1||Micro scale:1||Micro structure:1||Micro tool electrode:1||Micro wire EDM:1||MicroEDM:1||MicroEDM (마이크로 방전가공):1||Microelectrical discharge machining:1||Microgrinding:1||Microchannel:1||Microgrinding:1||Microlens (마이크로 렌즈):1||Microlens (마이크로렌즈):1||Micromachining (미세 가공):1||Micropatterned insert:1||Micropillar:1||Nanoscale cutting:1||Nanosecond Pulsed Laser (나노초펄스 레이저):1||Oxide:1||Polishing:1||Poly crystalline diamond tool:1||Polymer:1||Quartz:1||ReverseEDM:1||Scratching:1||SiC ceramic:1||Silicon carbide:1||Simulation (시뮬레이션:1||Singlecrystal copper:1||Solvent vapor polishing (솔벤트 증기 연마):1||Solventvaporassisted reflow (솔벤트 증기처리 리플로우):1||Superhydrophobicity:1||Surface Roughness (표면 조도):1||Surface texturing:1||Taper shape:1||Textured tool:1||Tungsten carbide:1||Tungsten carbide alloy:1||Vibration:1||Vibrationassisted:1||Water contact angle:1||Wear:1||Wire:1||Wire EDM:1||Wire EDM (electrical discharge machining):1||Wire Electro Discharge Machining:1||Wire electro discharge machining (WEDM):1||alumina:1||anodic aluminum oxide (AAO):1||ceramics:1||eccentric tool:1||edge radius:1||glass molding:1||glassbased biochip:1||grinding:1||light extraction:1||micro hole array:1||micro mold:1||microgrinding:1||micromilling:1||micro/nano hybrid lens (MNHL):1||microdrilling:1||microfluidic chip:1||polycrystalline diamond:1||zirconia:1||기계가공:1||미세 가공:1||미세 드릴링:1||미세 채널:1||미세 핀:1||방전 가공:1||3D structure:1||탄화규소 세라믹:1||Block EDM:1||CNF (carbon nanofiber):1||Cemented carbide:1||Chip formation:1||Cutting force:1||Difficulttocut material:1||ECDM:1||EDM:1||Eccentric tool:1||Electrical Discharge Machining (방전 가공):1||Electro Discharge Machining:1||Electrochemical Discharge Machining:1||Electrochemical discharge machining:1||Electrochemical machining:1||Electrochemical oxidation assisted machining:1||Electrolyte:1||Electrolytic corrosion:1||FEM:1||

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