Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choe, Seunghoe | - |
dc.contributor.author | Kim, Myung Jun | - |
dc.contributor.author | Kim, Hoe Chul | - |
dc.contributor.author | Lim, Taeho | - |
dc.contributor.author | Park, Kyung Ju | - |
dc.contributor.author | Cho, Sung Ki | - |
dc.contributor.author | Kim, Soo-Kil | - |
dc.contributor.author | Kim, Jae Jeong | - |
dc.date.available | 2019-03-09T02:40:58Z | - |
dc.date.issued | 2013-04 | - |
dc.identifier.issn | 0013-4651 | - |
dc.identifier.issn | 1945-7111 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/15067 | - |
dc.description.abstract | Seed layer repairing, a complementary technology to the fabrication of continuous Cu seed layers for acid Cu superfilling, was carried out in alkaline pyrophosphate solution by modified two-step electrodeposition. A short potential pulse was applied for nucleation prior to the second step, which was application of a lower potential for growth. This technique increased the surface coverage of damaged Cu seed layers from 78.10% to 99.46%. It was also shown to have the ability to repair an artificially damaged Cu seed layer with a 55 nm wide trench and to guarantee successful filling performance. (C) 2013 The Electrochemical Society. [DOI: 10.114912.028306jes] All rights reserved. | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | ELECTROCHEMICAL SOC INC | - |
dc.title | Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling | - |
dc.type | Article | - |
dc.identifier.doi | 10.1149/2.028306jes | - |
dc.identifier.bibliographicCitation | JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.160, no.4, pp D202 - D205 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.wosid | 000316976800057 | - |
dc.identifier.scopusid | 2-s2.0-84875726991 | - |
dc.citation.endPage | D205 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | D202 | - |
dc.citation.title | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | - |
dc.citation.volume | 160 | - |
dc.type.docType | Article | - |
dc.publisher.location | 미국 | - |
dc.subject.keywordPlus | PHYSICAL VAPOR-DEPOSITION | - |
dc.subject.keywordPlus | COPPER ELECTRODEPOSITION | - |
dc.subject.keywordPlus | ADDITIVE SYSTEM | - |
dc.subject.keywordPlus | STEP COVERAGE | - |
dc.subject.keywordPlus | LAYER | - |
dc.subject.keywordPlus | SPS | - |
dc.subject.keywordPlus | TA | - |
dc.subject.keywordPlus | ACCELERATOR | - |
dc.subject.keywordPlus | ELECTROLYTE | - |
dc.subject.keywordPlus | BARRIER | - |
dc.relation.journalResearchArea | Electrochemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Electrochemistry | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.description.journalRegisteredClass | sci | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
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