Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling
- Authors
- Choe, Seunghoe; Kim, Myung Jun; Kim, Hoe Chul; Lim, Taeho; Park, Kyung Ju; Cho, Sung Ki; Kim, Soo-Kil; Kim, Jae Jeong
- Issue Date
- Apr-2013
- Publisher
- ELECTROCHEMICAL SOC INC
- Citation
- JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.160, no.4, pp D202 - D205
- Journal Title
- JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Volume
- 160
- Number
- 4
- Start Page
- D202
- End Page
- D205
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/15067
- DOI
- 10.1149/2.028306jes
- ISSN
- 0013-4651
1945-7111
- Abstract
- Seed layer repairing, a complementary technology to the fabrication of continuous Cu seed layers for acid Cu superfilling, was carried out in alkaline pyrophosphate solution by modified two-step electrodeposition. A short potential pulse was applied for nucleation prior to the second step, which was application of a lower potential for growth. This technique increased the surface coverage of damaged Cu seed layers from 78.10% to 99.46%. It was also shown to have the ability to repair an artificially damaged Cu seed layer with a 55 nm wide trench and to guarantee successful filling performance. (C) 2013 The Electrochemical Society. [DOI: 10.114912.028306jes] All rights reserved.
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Collections - College of ICT Engineering > School of Integrative Engineering > 1. Journal Articles
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