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Self-consistent global model for inductively coupled Cl-2 plasma: Comparison with experimental data and application for the etch process analysis

Authors
Efremov, A. M.Kim, Gwan-HaKim, Jong-GyuKim, Chang-Il
Issue Date
May-2007
Publisher
ELSEVIER SCIENCE SA
Keywords
Cl-2 plasma; dissociation; rate coefficient; etch rate
Citation
THIN SOLID FILMS, v.515, no.13, pp 5395 - 5402
Pages
8
Journal Title
THIN SOLID FILMS
Volume
515
Number
13
Start Page
5395
End Page
5402
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/24076
DOI
10.1016/j.tsf.2007.01.027
ISSN
0040-6090
1879-2731
Abstract
The investigations of the influence of gas pressure and input power on the Cl-2 plasma parameters in the inductively coupled plasma system were carried out. The investigations combined plasma diagnostics by Langmuir probe and plasma modeling using the self-consistent global model with Maxwellian approximation for electron energy distribution function. From the experiments, it was found that an increase of gas pressure in the range of 0.27-3.33 Pa at 400-700 W input power results in decreasing both electron temperature (3.3-2.0 eV) and density (6.6 x 10(10) - 3.0 x 10(10) cm(-3) for 400 W and 1.2 x 10(11) -6.4 x 10(10) cm(-3) for 700 W). The model showed an outstanding agreement with the experiments and provided the data on densities and fluxes of active species. These data combined with the model of etch kinetics demonstrated the possibility of different etch rate behaviors depending on the input process parameters as well as on the properties of the etched surface. (C) 2007 Elsevier B.V. All rights reserved.
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Kim, Chang Il
창의ICT공과대학 (전자전기공학부)
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