Design and analysis of integrated-circuit package antenna (ICPA) for dual-band wireless transceivers

Abstract

This article presents study of a dual-band integrated-circuit package antenna (ICPA), which operates concurrently on dual bands at 2.4 and 5.25 GHz. The antenna is designed and printed on the top surface of an IC package and fed by a single coaxial line, while the transceiver is implemented on the opposite side of the package, through the separation of a common ground plate. This "cavity-down" arrangement minimizes the electromagnetic interference between the antenna and transceiver, and satisfies the miniaturization of the design. The study consists of numerical computations, which are performed through an in-house computer solver based on the nonuniform finite-difference time-domain (NU-FDTD) method and experimental measurements. Together with the data computed using the high-frequency structure simulator (HFSS) software, the results show excellent agreement between the numerical and experimental data, and the proposed structure is deemed as a useful application in the area of highly integrated wireless transceivers. (C) 2006 Wiley Periodicals, Inc.