Critical adhesion energy of benzocyclobutene-bonded wafers
DC Field | Value | Language |
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dc.contributor.author | Kwon, Y. | - |
dc.contributor.author | Seok, J. | - |
dc.contributor.author | Lu, J.-Q. | - |
dc.contributor.author | Cale, T.S. | - |
dc.contributor.author | Gutmann, R.J. | - |
dc.date.available | 2019-06-10T08:30:47Z | - |
dc.date.issued | 2006-04 | - |
dc.identifier.issn | 0013-4651 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/25562 | - |
dc.description.abstract | The dependencies of critical adhesion energy (CAE) of benzocyclobutene (BCB) bonded wafers on BCB thickness, the use of an adhesion promoter, and the materials being bonded are studied using a four-point-bending technique. The thicknesses of BCB used in the experiments ranged from 0.4 to 7.0 μm. The CAE depends linearly on BCB thickness due to the thickness-dependent contribution of plastic dissipation energy of the BCB and thickness independence of BCB yield strength. The CAE increases by approximately a factor of 2 when an AP is used for both 2.6- and 0.4-μm -thick BCB bonding layers because of chemical interactions. The CAEs measured at the interfaces between a Si wafer with plasma-enhanced chemical vapor deposited (PECVD) SiO2 and BCB and between a Si wafer with thermally grown SiO2 and BCB are approximately a factor of 3 higher than the CAE between a PG&O 1737 aluminosilicate glass wafer and BCB. The observed bond energies are about 18 and 22 J m2 at the interfaces between PECVD oxide and BCB and between thermally grown oxide and BCB, respectively. These bond energies correspond to bond densities of 12-13 and 15-16 Si-O bonds nm2. © 2006 The Electrochemical Society. All rights reserved. | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.title | Critical adhesion energy of benzocyclobutene-bonded wafers | - |
dc.type | Article | - |
dc.identifier.doi | 10.1149/1.2172551 | - |
dc.identifier.bibliographicCitation | Journal of the Electrochemical Society, v.153, no.4, pp G347 - G352 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.scopusid | 2-s2.0-33644812081 | - |
dc.citation.endPage | G352 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | G347 | - |
dc.citation.title | Journal of the Electrochemical Society | - |
dc.citation.volume | 153 | - |
dc.type.docType | Article | - |
dc.publisher.location | 미국 | - |
dc.subject.keywordPlus | Adhesion | - |
dc.subject.keywordPlus | Bending tools | - |
dc.subject.keywordPlus | Energy dissipation | - |
dc.subject.keywordPlus | Oxides | - |
dc.subject.keywordPlus | Plasma enhanced chemical vapor deposition | - |
dc.subject.keywordPlus | Plastics | - |
dc.subject.keywordPlus | Yield stress | - |
dc.subject.keywordPlus | Adhesion promoters | - |
dc.subject.keywordPlus | Benzocyclobutene (BCB) bonded wafers | - |
dc.subject.keywordPlus | Bond energies | - |
dc.subject.keywordPlus | Critical adhesion energy (CAE) | - |
dc.subject.keywordPlus | Hydrocarbons | - |
dc.description.journalRegisteredClass | scopus | - |
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