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다이아몬드를 이용한 차세대 마이크로 전자에미터 패키징
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이승목 | - |
| dc.contributor.author | 김종민 | - |
| dc.date.available | 2019-07-16T03:58:22Z | - |
| dc.date.issued | 2005 | - |
| dc.identifier.issn | 2466-2232 | - |
| dc.identifier.issn | 2466-2100 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/28178 | - |
| dc.format.extent | 6 | - |
| dc.publisher | 대한용접접합학회 | - |
| dc.title | 다이아몬드를 이용한 차세대 마이크로 전자에미터 패키징 | - |
| dc.title.alternative | Research for the Micro Packaging of Diamond Electron Emitter | - |
| dc.type | Article | - |
| dc.identifier.bibliographicCitation | 대한용접접합학회지, v.23, no.2, pp 41 - 46 | - |
| dc.identifier.kciid | ART000934292 | - |
| dc.description.isOpenAccess | N | - |
| dc.citation.endPage | 46 | - |
| dc.citation.number | 2 | - |
| dc.citation.startPage | 41 | - |
| dc.citation.title | 대한용접접합학회지 | - |
| dc.citation.volume | 23 | - |
| dc.description.journalRegisteredClass | kci | - |
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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