화학-기계적 연마 공정의 물질제거 메커니즘 해석Part I: 연성 통합 모델링
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 석종원 | - |
dc.contributor.author | 석종혁 | - |
dc.contributor.author | 오승희 | - |
dc.date.available | 2019-07-24T03:03:45Z | - |
dc.date.issued | 2007 | - |
dc.identifier.issn | 1738-2270 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/30017 | - |
dc.description.abstract | An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry. | - |
dc.format.extent | 6 | - |
dc.publisher | 한국반도체디스플레이기술학회 | - |
dc.title | 화학-기계적 연마 공정의 물질제거 메커니즘 해석Part I: 연성 통합 모델링 | - |
dc.title.alternative | An Analysis on the Material Removal Mechanism of Chemical-Mechanical Polishing Process Part I: Coupled Integrated Material Removal Modeling | - |
dc.type | Article | - |
dc.identifier.bibliographicCitation | 반도체디스플레이기술학회지, v.6, no.2, pp 35 - 40 | - |
dc.identifier.kciid | ART001061753 | - |
dc.description.isOpenAccess | N | - |
dc.citation.endPage | 40 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 35 | - |
dc.citation.title | 반도체디스플레이기술학회지 | - |
dc.citation.volume | 6 | - |
dc.publisher.location | 대한민국 | - |
dc.subject.keywordAuthor | Chemical-Mechanical Polishing | - |
dc.subject.keywordAuthor | Thermal-Chemical-Mechanical Modeling | - |
dc.subject.keywordAuthor | Contact Mechanics | - |
dc.subject.keywordAuthor | Arrhenius Equation | - |
dc.description.journalRegisteredClass | kciCandi | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
84, Heukseok-ro, Dongjak-gu, Seoul, Republic of Korea (06974)02-820-6194
COPYRIGHT 2019 Chung-Ang University All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.