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P의 함량에 따른 Sn-Ag-Cu 및 Sn-Cu 무연솔더의 특성평가Characterization of the Sn-Ag-Cu and Sn-Cu Lead-free Solder by adding P
- Issue Date
- 2003
- Publisher
- 한국전기전자재료학회
- Keywords
- Lead-free Solder; Solderability; Wetting balance test; Intermetllic compound(IMC)
- Citation
- 전기전자재료학회논문지, v.16, no.6
- Journal Title
- 전기전자재료학회논문지
- Volume
- 16
- Number
- 6
- ISSN
- 1226-7945
- Abstract
- The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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