Thermally conductive and highly rigid polylactic acid (PLA) hybrid composite filled with surface treated alumina/nano-sized aluminum nitride

Abstract

Recently, biodegradable polylactic acid has shown a high potential to replace petrochemical-based polymers for thermal interface materials in micro-electronics packaging applications. In this study, we fabricated a PLA composite, filled with surface modified alumina and nano-aluminum nitride particles, using solution casting methods. The synergic effects between these thermally conducive hybrid fillers improved the thermal conductivity of the PLA composite. A scanning electron microscope micrograph of the surface fractured composites revealed that there is good adhesion between the PLA matrix and the surface functionalized particles. Consequently, the thermal conductivity of a PLA composite with 40% filler loading showed 150% improvement when compared to that of the neat PLA. In addition, the composites became highly rigid with the increase in the filler loading. In general, the PLA composites that were synthesized exhibited enhanced thermal conductivity, which makes them be a good candidate for thermal interface materials. © 2019 Elsevier Ltd