3-Dimensional Direct Patterning Methods Based on the Laser Ablation Method

Abstract

Laser direct patterning technologies have been attracted great attention for their simple process and low fabrication cost compared with those of photo-lithography based patterning process. With the development of functional semiconductor devices with complicated structure, strong needs have been required to have advanced fabrication method with high accuracy and low cost. As emerging areas, Internet of things (IoT) have focused on the unique design with additionally functional structure for future applications. Thus, future electronic industries such as touch panel devices, autonomous navigation vehicles, flexible printed circuit boards have been developed very rapidly and fiercely. Therefore, there have been strong demands to develop an advanced fabrication method such as direct patterning which can be applied to more complicated structure with simple process. As an alternative advanced fabrication process, 3-dimensional direct patterning method was prepared and discussed. The schematic structure and functions will be explained and discussed.