Additive-free superfilling in damascene Cu Electrodeposition using microcontact printing
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Soo-Kil | - |
dc.contributor.author | Kim, JJ | - |
dc.date.available | 2020-07-29T02:20:37Z | - |
dc.date.issued | 2004-09 | - |
dc.identifier.issn | 1099-0062 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/42425 | - |
dc.description.abstract | To avoid complications brought about by employing organic additives, microcontact printing using a flat stamp was used in forming trench-selective Cu superfilling on damascene structure. Self-assembled monolayers of 1-decanethiol transferred on top surface of the trench could withstand the H2SO4 electrolyte and were used as a barrier for current transfer below a certain potential that was not yet dominated by the tunneling current. Subsequent electrodeposition on the printing area was successfully inhibited. The resulting filling profile was a defect-free superfilling with bumps on top. This is comparable to the three-additive system consisting of accelerator and two-component suppressor. (C) 2004 The Electrochemical Society. | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | ELECTROCHEMICAL SOC INC | - |
dc.title | Additive-free superfilling in damascene Cu Electrodeposition using microcontact printing | - |
dc.type | Article | - |
dc.identifier.doi | 10.1149/1.1778932 | - |
dc.identifier.bibliographicCitation | ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.9, pp C101 - C103 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.wosid | 000223472300014 | - |
dc.identifier.scopusid | 2-s2.0-4944253002 | - |
dc.citation.endPage | C103 | - |
dc.citation.number | 9 | - |
dc.citation.startPage | C101 | - |
dc.citation.title | ELECTROCHEMICAL AND SOLID STATE LETTERS | - |
dc.citation.volume | 7 | - |
dc.type.docType | Article | - |
dc.publisher.location | 미국 | - |
dc.subject.keywordPlus | SELF-ASSEMBLED MONOLAYERS | - |
dc.subject.keywordPlus | PATTERN TRANSFER | - |
dc.subject.keywordPlus | SUPERCONFORMAL ELECTRODEPOSITION | - |
dc.subject.keywordPlus | COPPER | - |
dc.subject.keywordPlus | ALKANETHIOLS | - |
dc.subject.keywordPlus | MODEL | - |
dc.relation.journalResearchArea | Electrochemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Electrochemistry | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
84, Heukseok-ro, Dongjak-gu, Seoul, Republic of Korea (06974)02-820-6194
COPYRIGHT 2019 Chung-Ang University All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.