Additive-free superfilling in damascene Cu Electrodeposition using microcontact printing
- Authors
- Kim, Soo-Kil; Kim, JJ
- Issue Date
- Sep-2004
- Publisher
- ELECTROCHEMICAL SOC INC
- Citation
- ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.9, pp C101 - C103
- Journal Title
- ELECTROCHEMICAL AND SOLID STATE LETTERS
- Volume
- 7
- Number
- 9
- Start Page
- C101
- End Page
- C103
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/42425
- DOI
- 10.1149/1.1778932
- ISSN
- 1099-0062
- Abstract
- To avoid complications brought about by employing organic additives, microcontact printing using a flat stamp was used in forming trench-selective Cu superfilling on damascene structure. Self-assembled monolayers of 1-decanethiol transferred on top surface of the trench could withstand the H2SO4 electrolyte and were used as a barrier for current transfer below a certain potential that was not yet dominated by the tunneling current. Subsequent electrodeposition on the printing area was successfully inhibited. The resulting filling profile was a defect-free superfilling with bumps on top. This is comparable to the three-additive system consisting of accelerator and two-component suppressor. (C) 2004 The Electrochemical Society.
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