Large Size of Capacitive Window-Unified TSP Using by Contact Hole Type as an Insulator

Abstract

We developed 30 '' window-unified capacitive touch screen panel (G2-TSP), where the transparent electrodes for sensing and driving lines were directly patterned on the glass. In this study, index-matched ITO as the main electrode was fabricated using by sputtering system which had sheet resistance of 30 ohm/square and transmittance of 88.6% at wavelength of 550 nm. We used SiOC of contact-hole type as a dielectric layer for high deposition rate and etching selectivity. Finally, we developed copper material (110 nm-thick) as bridge and bezel metal with sheet resistance of 2 ohm/square. From these processes, we successfully fabricated the 30 inch G2 TSP with no-short and open parts of TSP-cells. We fabricated G2 TSP with the wet-etching process, linearity of 0.86 mm and accuracy of 0.83 mm have been achieved.