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Results 1-1 of 1 (Search time: 0.004 seconds).
Chip bonding on non-rigid and flexible substrates with new stepped processes
Park, Sung Kyu
; Han, J.I.; Kim, W.K.; Kwak, M.G.
Article
Issue Date
2001
Citation
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.40, no.1, pp 412 - 418
Publisher
INST PURE APPLIED PHYSICS
1
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Author
Han, J.I.
1
Kim, W.K.
1
Kwak, M.G.
1
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ACF
1
plastic substrates
1
stepped heating and pressure
1
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Article
1
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ENG
1
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JAPANESE JOURNAL OF APPLIED PHYSI...
1
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